After evaluating several alternatives, ChipMOS has selected Xcerra’s total test cell solution as its preferred test platform for high-volume production of MEMS devices at its Shanghai facility. ChipMOS is an industry leading provider of semiconductor assembly and test services with factories in Hsinchu and Southern Taiwan Science Parks in Taiwan and Shanghai. ChipMOS is now prepared to support further MEMS fabless and IDM customers’ mobility, automotive, and IoT volume production requirements for MEMS calibration and test in Shanghai.
The Xcerra MEMS test cell incorporates the cost-efficient LTX-Credence Diamondx tester and the high-throughput Multitest InMEMS/InCarrier solution. ChipMOS chose the Xcerra test cell solution because it combines Diamondx’s high parallel test capability with Multitest’s advanced package handling and MEMS stimulus options. The fully integrated solution delivers a pre-validated test cell directly to ChipMOS’s manufacturing floor, minimizing the time to high-volume production. The initial cells are equipped to switch between high multisite testing of 3DOF magnetometer devices on a strip or 3DOF and 2DOF accelerometer devices in a carrier.
With the Xcerra MEMS test cell, ChipMOS and their fabless customers fully benefit from the Xcerra expertise in test cell integration—including tester-handler communication, test interface design, and MEMS stimulus integration. The high test cell throughput results in a significant cost of test reduction. Even with the integration the test setup retains a high degree of flexibility for ChipMOS to reconfigure the test cell for other applications and sensor types.
S.J. Cheng, chairman and CEO of ChipMOS, commented, “As a leading provider of semiconductor assembly and test services we continuously strive to optimize our equipment so we can offer our customers the highest quality and throughput, at the best price. The Xcerra MEMS test cell enables us to achieve these goals today for 6DOF accelerometer and magnetometer test. Due to the flexibility of the Xcerra MEMS test cell, we are able to efficiently expand our MEMS test capabilities at any times for pressure, barometric or humidity sensors and MEMS microphones. The option to test devices on strip or in carrier allows us to reliably handle wafer level packages.”
Andreas Nagy, senior director, TCI, added, “We understand that the OSAT business requires highest flexibility and the ability to adjust to new customer applications and order volumes rapidly. With the Xcerra test cell offering, we are able to provide leading technical solutions, which combine the benefits of system level integration with the wide flexibility to reconfigure the setup fast.”