Albuquerque, NM. Optomec announced at IPC Apex Expo the launch of its Aerosol Jet HD system for electronics packaging. The Aerosol Jet HD System is designed to address today’s demanding electronics packaging challenges, including the increasing density of electronic components. The Aerosol Jet HD system is a compact, configurable production platform that can dispense a range of electronics materials with features as small as 20 microns. The system can also produce larger features, from hundreds of microns to millimeters in a single pass, and it can print wide-area conformal coatings from 100 nm to tens of microns in thickness.
During the expo, Mike O’Reilly, director, aerosol jet products at Optomec, participated in a “Buzz Session” titled “3D Printed Electronics Are You Ready to Take Your Company to the Next Dimension?” He also participated in a panel discussion on additive printing.
Throughout the duration of the expo, the company is offering live demos of the Optomec Aerosol Jet HD system, which is based on Optomec’s patented Aerosol Jet technology, a fine-feature material deposition solution used to directly print functional electronic circuitry and components onto low-temperature, nonplanar substrates, without the need for masks, screens, or subtractive post-processing. Based on the next-generation of Optomec’s production-proven Aerosol Jet print engine, coupled with in-line automation, the HD system can handle a variety of substrate sizes and compositions, providing high-resolution printed electronics for today’s demanding advanced packaging applications such as 3D interconnects, conformal RF/EMI shielding, and precision micro-dispense of insulators and adhesives.
Examples of functional printed electronics by Optomec customers such as the University of Maryland and BAE Systems are on display.