SAN CARLOS, CA. Alliance Memory has announced that it has expanded its product offering with a new line of high-speed CMOS DDR4 SDRAMs. For improved performance over previous-generation DDR3 devices, the 4-Gb AS4C256M16D4 and AS4C512M8D4 offer lower power consumption and faster data transfer rates in 96-ball and 78-ball FBGA packages.
With minimal die shrinks, the DDR4 SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for numerous similar solutions—eliminating the need for costly redesigns and part requalification. Offered in extended commercial (0°C to +95°C) and industrial (-40°C to +95°C) temperature ranges, the devices are suitable for the industrial, medical, IoT, automotive, gaming, and consumer markets.
The AS4C256M16D4 and AS4C512M8D4 support sequential and interleave burst types with read or write burst lengths of BL8/BC4/BC4 or 8 on the fly. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh. JEDEC- and RoHS-compliant, the devices are lead (Pb)- and halogen-free.
Samples of the new 4-Gb DDR4 SDRAMs are available now. Production quantities will be available in November 2019, with lead times of eight weeks. Pricing for U.S. delivery starts at $3.00 per piece.