Wi-Fi Alliance Okays CEVA’s Wi-Fi 6 IP Platform

802.11ax MAC and modem IP is the world’s first Wi-Fi 6 IP to achieve certified status.

Aug. 25, 2020

2 min read

In its RivieraWaves Wi-Fi 6 IP platform, CEVA has what’s claimed to be the world’s first Wi-Fi IP to achieve Wi-Fi CERTIFIED 6 Status from the Wi-Fi Alliance. CEVA offers a complete suite of Wi-Fi 6 IPs, spanning 1x1 20 MHz for low-power IoT devices through MIMO 80/160-MHz Wi-Fi 6 and 6E for higher-end products including smartphones, smart TVs, access points, and wireless infrastructure. CEVA’s Wi-Fi 6 IPs have already been licensed to multiple semiconductor companies and OEMs for upcoming products.

The Wi-Fi CERTIFIED 6 certification is designed to distinguish Wi-Fi 6 products and networks that meet the highest standards for security and interoperability to deliver exceptional end-user experiences and wireless stability. Wi-Fi CERTIFIED 6 products provide significant capacity, performance, and latency improvements to the entire Wi-Fi ecosystem, while ensuring that solutions from multiple vendors interoperate to help enable greater innovation and opportunity.

The RivieraWaves Wi-Fi IP family offers a comprehensive suite of IPs and platforms for embedding Wi-Fi connectivity into SoCs/ASSPs, addressing a broad range of applications. These tiny footprint, very low power but high-performance Wi-Fi IPs are compliant with Wi-Fi 6 1x1 & 2x2. They consist of Wi-Fi 6 MAC and Modem, available in both 1x1 SISO and 2x2 MIMO configurations. They're also provided with LMAC (aka thinMAC) for use with Linux/Android mac80211 UMAC, LMAC+UMAC (aka FullMAC), and LMAC+UMAC integrated into FreeRTOS (aka FullyHosted) software protocol stacks.

In addition, the IPs come with an integration-ready processor and OS-agnostic platform, simplifying deployment in SoC/ASSP designs. The Wi-Fi software protocol stacks can be executed on any processor, such as Arm, RISC-V, ARC, Andes, and others. The RivieraWaves Wi-Fi 6 platforms can be used in a standalone single chip or integrated into a bigger SoC such as an application processor, baseband processor, or multi-standard wireless combos.

About the Author

David Maliniak

MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.