Compound withstands high temperatures in lead-free soldering

A liquid crystal polymer (LCP) compound formulated by RTP Company for automotive sensor developer Accumold enables Accumold to meet high-temperature requirements for lead-free soldering.

RTP’s compounds are said to meet WEEE (waste from electric and electronic equipment) and RoHS (Restriction of the Use of Certain Hazardous Substances) lead-free directives. Components exposed to lead-free solder alloys must be capable of withstanding temperatures of 260 degrees C or greater. The directives’ greatest impact falls on the thermoplastic materials in connectors and board level components such as capacitor housings and potentiometers. As a result, high temperature thermoplastic technology is now a critical factor in product design, according to RTP.