IC Interconnect achieves ISO standards

IC Interconnect claims to be among the first wafer bumping service providers to complete the registration audit for ISO/TS 16949:2002 and 9001:2000, which encompass American (QS-9000), German (VDA6.1), French (EAQF) and Italian (AVSQ) automotive quality standards.
May 12, 2005

IC Interconnect claims to be among the first wafer bumping service providers to complete the registration audit for ISO/TS 16949:2002 and 9001:2000, which encompass American (QS-9000), German (VDA6.1), French (EAQF) and Italian (AVSQ) automotive quality standards.

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