IPC plans press-fit pin standard for automotive requirements

Aug. 19, 2016

Bannockburn, IL. IPC-Association Connecting Electronics Industries has announced plans to start the development of a new standard intended to cover the qualifications and acceptance requirements for press-fit pin technology that includes the reliability needs for automotive and other industries, such as aerospace.

The organization says this new standard is highly anticipated, as there is currently not a specific standard to support press-fit pin automotive requirements and other high-reliability applications. The yet-to-be-named standard is expected to be released late 2017. The IPC standards development process will bring together collaboration between design and assembly task groups as well as all considerations and criteria for applicable documents of both design and assembly.

“This newly proposed standard is exciting for multiple reasons. First, it is a document specifically requested by the European automotive electronics industry and is further evidence that European stakeholders are embracing IPC’s efforts to engage them in IPC’s global standardization process,” said Dave Bergman, IPC vice president of standards and training. “Additionally, it will help to close a technology hole in IPC’s standardization tree by adding a fresh look at the use of press-fit pin technology in electronic hardware.”

This document will be IPC’s second significant standard developed to support the rapidly growing automotive electronics industry. The development of standards continues to be one of the IPC’s core value propositions and the automotive electronics industry is one of the key verticals in Europe.

“IPC views this press-fit pin standard activity as an important step in our mission to deliver value to our growing membership in Europe and to help make them more financially successful,” added Sanjay Huprikar, IPC vice president of member success. “As we continue to utilize our European members as strong voices and champions in the development of our educational offerings and events, we are encouraging these members to get more involved in developing standards for the industry.”

www.ipc.org/standards

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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