East Aurora, NY. Astronics Corp. through its wholly-owned subsidiary Astronics Test Systems has introduced its new system-level test (SLT) platform that is expected to revolutionize the testing of high-volume integrated semiconductor devices. The new ATS 5034 SLT platform improves production efficiency and reduces the cost of test by processing up to 396 devices simultaneously.
This new platform is suitable for testing the latest semiconductor devices for mobile, automotive, wearable, and industrial applications. The ATS 5034 SLT platform can be tailored to meet precise production test requirements. Customers will benefit from the reduced footprint of the ATS 5034 SLT platform and the ability to test up to 5,000 units per hour (UPH).
“For the past 20 years, we’ve provided system-level and burn-in testers that have tested more than 9 billion semiconductor devices globally,” explained Jon Sinskie, executive vice president of Astronics Test Systems. “The ATS 5034 SLT platform is our newest tester, which for the first time offers an affordable method for semiconductor manufacturers to improve yields by implementing a 100% SLT test insertion in production.”
The new ATS 5034 SLT Platform tests integrated semiconductors in “mission mode” to verify performance of the semiconductor at the operating level. Traditionally a difficult, expensive test insertion, the new ATS 5034 makes it simple for manufacturers to now transition to 100% SLT affordably. An engineer can design a test sequence for a single site, and the ATS 5034 SLT platform easily scales that sequence to hundreds of sites.
“With the increasing complexity of today’s semiconductor devices and pressures to cost-effectively hit aggressive time-to-market schedules, customers are looking for new ways to find defects that are missed during traditional ATE functional testing, ” explained Anil Bhalla, senior marketing manager for Astronics Test Systems. “We’ve built a platform that enables customers to find these defects with SLT in a way that previously was not cost effective.”
Customizable and adaptable, this versatile modular platform satisfies a variety of manufacturing test functions including system characterization, validation, qualification, system-level test, and RMA/failure debug.
The system can test up to 396 integrated semiconductor devices—such as microprocessors, microcontrollers, and embedded systems—simultaneously, at a rate of up to 5,000 UPH. It supports popular package types: system on chip (SoC), module, and heterogeneous system in package (SiP) while providing turnkey automation with JEDEC tray inputs and outputs, including lot cascading.
It comes with Astronics’ ActivATE software, an easy-to-use test executive, and it provides accurate thermal stress testing capability (±1° C).
Astronics can further customize this platform for various low-, medium-, or high-volume system-level test scenarios. This platform also includes support from the Astronics program management organization, which oversees installation and maintenance at any global location. Units are in production and shipping in the first quarter of 2017.
