ANSYS

Simulate electronics cooling strategies to design products more effectively

Electronic devices are becoming smaller, denser, faster — and harder to keep cool. Heat adversely affects an integrated circuit’s reliability, and interconnecting a system’s chips using 2.5-D interposers or 3-D stacking makes it increasingly difficult to operate within a device’s thermal range.
June 27, 2017
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The ANSYS Chip-Package-System (CPS) design flow takes innovative electronic devices to the next level. Our simulation tools enable electrical and mechanical engineers to collaborate more effectively throughout a product’s design cycle. They provide electronics cooling for printed circuit boards (PCBs) and electronic packages and help determine whether board temperatures lie within safe operating limits. Download our white paper to learn more about the benefits of this design flow.