Smart Systems Integration 2010

Jan. 10, 2010

Smart systems integration involves the integration of different functions with a high degree of miniaturization, and the ability to keep costs flexible to meet reasonable cost

Roger Allan

Smart systems integration involves the integration of different functions like sensors, signal processing, actuators, photonics, power supplies, coolers with a high degree of miniaturization, and the ability to keep costs flexible to meet reasonable cost levels. That’s the opinion of Thomas Gessner, director of Germany’s Fraunhofer Research Institution for Electronic Nano Systems and chairman of this year’s Smart Systems Integration 2010 show, scheduled for this March in Como, Italy. The conference is part of the activities of the European Technology Platform on Smart Systems Integration (EPoSS).

“Such a single fully integrated package bridges the gap between nano electronics and the application and its environment,” Gessner says. He envisions using CMOS processes to build the package’s processor and memory circuitry and micro and nano systems technologies to build the power, sensor, communications, and actuator devices.

Gessner cites the ASIL (Active Smart ID Label) project his organization is working on as an example of the complexity of integrating MEMS and NMEMS technologies within a product that provides multiple functionalities. It is a priority topic within the European Union’s Microsystems Framework Programme and is a collaborative project of the German Federal Ministry of Education and Research (BMBF).

The project involves the development of an active radio-frequency identification (RFID) label for the monitoring of shock, inclination, humidity, and temperature levels of boxed and packaged goods while they’re being transported. The RFID label must consume low levels of energy. It also must feature high-temperature stability and a high signal-to-noise ratio. And, it must have a thin form factor. Partnering with Franhofer on this project are Germany’s KSW Microtec, Elmos Semiconductor, Memsfab, and Schenker.

Smart Systems Integration 2010
www.smart-systems-integration.org/public

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.