Opposed to a traditional metal-base plate, the Hockey Puck series solid-state relays incorporate a ceramic substrate for direct contact with the heat sink, significantly reducing thermal resistance between the power semiconductor in the SSR and the internal heatsink. The relays combine fused-copper power semiconductors with ceramic surface-mount technology in the control and opto-isolation stages of the SSR.Mounting of the power semiconductor involves applying the lead frame containing the power devices directly to the substrate.
Company: TELEDYNE RELAYS
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