New Design Boosts Relay Performance

Jan. 1, 2000
The GN series solid-state power relays utilize a direct-bond copper substrate and an improved power-lead design that greatly enhances thermal performance. A new cast baseplate provides a flatter surface, resulting in a better bond with thermal

The GN series solid-state power relays utilize a direct-bond copper substrate and an improved power-lead design that greatly enhances thermal performance. A new cast baseplate provides a flatter surface, resulting in a better bond with thermal compounds. Other features include an LED indicator, current ratings up to 125A, and an optional IP20 touch-safe cover. The relays are VDE, CE, UL and cUL approved and meet EMC compliance Level 3 standards. According to the company, these relays will not fail, false trigger, or get damaged from ESDs, radiated or conducted high-frequency noise, transients, or surges.

Company: CROUZET CORP.

Product URL: Click here for more information

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