Thumbnail Esmotalos Handler2021 60817c8caf75a

esmo Upgrades the talos Handler 2021 for Automated Microchip Testing

April 22, 2021
The system provides multiple automated test cycles at different temperatures within a short timeframe.

esmo groupm, a full-service systems integrator, has rolled out upgrades and additional features for their talos 2021 system. First launched in 2019, the talos engineering handler is a reliable and easy-to-use handling system for semiconductor test applications, and is esmo’s solution to the industry’s need to cost-effectively test increasingly compact and complex devices within a shorter period of time.

At the core of the talos engineer handler is its state-of-the-art active thermal control system (ATC), which allows manufacturers to carry out multiple test temperature cycles and achieve the highest temperature accuracy. The talos system supports the testing of devices with any site pitch dimension, which allows semiconductor companies to use already existing production load boards and sockets seamlessly. Its tray or tube loading and unloading feature also makes it possible for manufacturers to run the talos system in a mixed media operation. As such, loading trays, tubes, and tapes can be combined with their unloading counterparts, and devices can even be sorted from one media to another, such as from tube to tray.

Designed to meet both test and production floor requirements, the talos handling system features a highly accurate pick-and-place robot system and a standard docking interface that is compatible with all testers. The talos can also be employed as a basic, kit-less test handler, or as an advanced test handling system with its expansive selection of optional modules.

Key features of the talos:

-60°C to +175°C (-76°F to +347°F) device testing temperature with ATC — Temperature is measured and controlled at the contact plunger to ensure highest accuracy levels

Junction regulation option available — Users can control the device’s core temperature, compensating power dissipation for highest temperature accuracy

Low test time — Minimal adjustment and conversion efforts required

High contact force of 450 N and above

Multiple automated test cycles at different temperatures within a short timeframe

High system uptimes and power-on times achievable at lower maintenance costs

Compact test cell footprint (in combination with esmo’s phoenix cart)

Moveable and modular system

Remote control available via Ethernet

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