Using silicon-on-silicon technology, two SRAM die are stacked on each side of a dual-cavity ceramic quad flatpack with dimensions of less than one inch. The die are radiation hardened to a total dose hardness through 1 x 106 rads. The WS128K32-25G2MRH 128K x 32 SRAM module is user-configurable as 256K x 16 or 512K x 8. The device has an access time of 25 ns and operates on 5V. The G2 package is a hermetic CQFP that conforms to the JEDEC 69-pin 0.990" footprint.
Company: WHITE ELECTRONIC DESIGNS CORP.
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