EE Product News

New DRAM Modules Double Capacity Of TSOP Modules

A proprietary low-profile, high-density Chip Scale Package (CSP) architecture is being employed to produce TinyBGA DRAMs for use in modules that pack the same amount of memory as TSOP modules in a space that is up to 50% smaller. For 64-MB DRAMs, for instance, TinyBGAs have package dimensions of 0.35"L x 0.47"W versus 0.46"L x 0.88"W for TSOPs. And with a height of

TAGS: Digital ICs
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