International Rectifier’s (IR) MOSFETs in the DirectFET package are the first surface-mount devices in an SO-8 footprint designed for efficient topside
International Rectifier’s (IR) MOSFETs in the DirectFET package are the first surface-mount devices in an SO-8 footprint designed for efficient topside cooling and that address the increasing challenge of removing heat from power systems. DirectFET MOSFETs are designed for high-performance power management systems in advanced IntelÒ and AMD microprocessors for notebook computers, high-end desktop PCs, and system servers.
DirectFET MOSFETs reduce part count by up to 60% and shrink circuit size by as much as 50%, compared to an SO-8 type solution—effectively doubling current density at a lower system cost.
“The DirectFET package introduces a ‘paradigm shift’ to the power management industry. Due to its unique double-sided cooling, DirectFET MOSFETs deliver distinct thermal advantages over traditional power MOSFETs in standard packaging,” said Carl Blake, technical marketing manager for the computing market at IR.