Interface ICs

Feb. 13, 2003
The ISL4260E and ISL83386E have joined Intersil Corp.’s LINEARLINK™ family of high-performance RS-232 interface ICs. The ISL4260E joins the ISL424XE/ISL4238E

The ISL4260E and ISL83386E have joined Intersil Corp.’s LINEARLINK™ family of high-performance RS-232 interface ICs. The ISL4260E joins the ISL424XE/ISL4238E RS-232 transceivers as the worlds smallest in a tiny 5 mm x 5 mm x 0.9 mm Quad Flat No-lead (QFN) package. The ISL83386E is a 20-lead TSSOP packaged version. Both package types are for use in any handheld battery-powered space-constrained device.

The ISL4260E and ISL83386E have three transmitters and two receivers. They operate over a 3 V to 5.5 V supply range and are fully compatible with 3 V, mixed 3 V and 5 V, and 5 V-only systems. They also feature a very low 300 uA supply current and an even lower power-down current of only 150 nA. The ISL83386E is a pin-for-pin match with the MAX3386E and SP3203E, and is intended for use in PDAs and other handheld devices requiring an RS-232 link to a PC.

A unique VL supply pin improves interoperation in mixed-voltage logic systems by adjusting the input thresholds and output logic levels to match the external supply. The RS-232 transmitters/receivers meet EIA/TIA-232 and V.28/V.24 specifications, even at Vcc = 3 V. ESD protection is provided (+/-15 kV, IEC610002 Air Gap and Human Body Model) on all transmitter outputs and receiver inputs.

The ISL4260E's QFN package occupies 40% less board space than the TSSOP package. Small lands on the underside perimeter provide circuit contact so there are no leads to become bent during handling or assembly. Unlike chip-scale packages that use an array of solder bumps, the perimeter lands of the QFN package allow post assembly inspection of solder joints. Special manufacturing equipment is not needed.

For more information, visit www.intersil.com.

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