Analog IC Supplier Expands Foundry Services; Signs Distribution Agreement

March 2, 2005
austriamicrosystems, a designer and manufacturer of analog integrated circuits (ICs) for industrial, medical, communications and automotive applications, has expanded its multi-product wafer service for CMOS, high-voltage and RF processes for its ...

austriamicrosystems, a designer and manufacturer of analog integrated circuits (ICs) for industrial, medical, communications and automotive applications, has expanded its multi-product wafer service for CMOS, high-voltage and RF processes for its foundry customers. The company’s Full Service Foundry provides a cost-efficient and fast ASIC prototyping service by combining several designs from different customers onto one wafer. This approach, known as Multi-Project Wafer (MPW) or shuttle run, allows sharing of costs for wafer and masks among different customers.

The company now offers a 0.35-µm HV-CMOS family with a 20-V CMOS process, ideal for power management products and display drivers, and a 50-V CMOS process, optimized for automotive and industrial applications. Another expansion of the MPW service is the availability of the advanced 0.35-µm process options for optoelectronic and CMOS processes with embedded EEPROM. austriamicrosystems offers more than 100 start dates in 2005. The detailed start dates per process are available on the web at asic.austriamicrosystems.com/MPW.

austriamicrosystems offers a range of processes in 0.8 µm and especially in 0.35 µm that are based on the 0.35-*#181;m CMOS process licensed from Taiwan Semiconductor Manufacturing Company (TSMC). The CMOS-compatible 0.35-µm silicon-germanium BiCMOS technology enables designs of RF circuits operating at frequencies of up to 10 GHz combined with high -density digital parts on one single ASIC.

The customer delivers GDSII-Data's at fixed dates and receives untested packaged samples or dies within a lead-time of typically 8 weeks for CMOS processes and 10 weeks for high-voltage CMOS,BiCMOS and SiGe-BiCMOS processes. All MPW runs will be produced at austriamicrosystems’ 8-in. wafer fab in Unterpremstaetten, Austria.

In a separate announcement, austriamicrosystems revealed a distribution partnership agreement with Future Electronics Inc., a distributor and marketer of semiconductors and passive, interconnect and electro-mechanical components, for key markets in the Americas and Europe.

Under the agreement, which is effective immediately, Future Electronics will distribute austriamicrosystems’ entire line of standard and standard linear IC products throughout North America, South America and Europe (with the exception of Finland, Sweden, the United Kingdom, Netherlands, Belgium and Luxembourg).

For more information, visit www.austriamicrosystems.com.

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