Methode Electronics Power Solutions Group to Participate in APEC 2014 With Expo and Seminar

Methode Power Solutions Group's Power Solutions Group is participating in the Applied Power Electronics Conference with a technology showcase in the Exposition and an educational exhibitor seminar.

Methode's expo booth features new power distribution modules and sub-assemblies, such as the newly updated and UL certified SmartPower Stack™ power conversion module, the Open Compute Project rack power connector, and the new Level 2 Electric Vehicle Charge Coupler. The expo also takes a closer look at the "building block" foundational technologies and capabilities that go into making the sub-assemblies, such as complex bus bars, high current power connector contacts, ultra-flexible cable and fusion terminations, thermal management, injection molding, PCB assembly, and global manufacturing.

Methode is located at booth #304 in the Expo hall.

The educational seminar presented by Methode's Power Solutions Group focuses on the best practices in the design of thermal management solutions for power electronics. This is a topic of high relevance to power electronics design engineers facing challenging component heat problems. This best practices overview reveals practical methods for finding the optimal solutions. The seminar was held on Tuesday March 18, at 2:15 p.m. in room 201.