TSMC Launches 0.13-Micron Flash Process

Taiwan Semiconductor Manufacturing Company (TSMC) has qualified its 0.13-micron embedded flash process and is set to begin production. According to a company release, TSMC is the first pure-play foundry to launch production of a fully logic compatible 0.13-micron process featuring embedded flash technology. The 0.13-micron embedded flash process employs the same split-gate flash cell as the previous generation. The company said it is fully compatible with TSMC's logic baseline of 0.13-micron general-purpose process and low power process. TSMC used copper wiring for the process node. "Technology savvy factors in our smooth introduction of copper wiring into the embedded flash process," Sam Chen, director of memory platform marketing at TSMC, said in a statement. "The process's low power transistor makes it ideal for ZigBee/Wibree devices, wireless headsets, hearing aids, SmartCards and other applications requiring ultra low power consumption ranging from 1.2V to 1.5V," Sam added. "And the value of this process can be further enhanced by TSMC's comprehensive and cost-effective embedded flash IP testing support."