DIGITAL· Daniel HarrisSign Of The Times: Digital Lanes Merge AheadASICs· Daniel HarrisASIC/ASSP Industry Faces Midlife CrisisMCUs· William WongOh, Those Money-Making MicrocontrollersFPGAs· Daniel HarrisFPGAs, Structured ASICs Bring Home The BaconDSP· William WongDSPs Here, There, And EverywhereANALOG· Don TuiteAnalog Firms Must Take A Global StanceAmplifiers· Don TuiteFresh Applications Breed New AmplifiersData Converters· Don TuiteSpecialized Data Converters Move Up The Signal ChainCOMMUNICATIONS· Louis E. FrenzelFast, Quick, Speedy...It's All A Comm GameCell Phones· Louis E. Frenzel3G May Be Here, But 4G Is On Its WayDSL· Louis E. FrenzelDSL Rules Broadband For NowCOMPONENTS· Roger AllanIt's Not Just A Matter Of Size For ComponentsInterconnects· William WongSwitch Fabrics Get ScalablePackaging· Roger Allan3D Methods Push The "Thin Is In" CrazeEDA· David MaliniakDown Come The Walls Between Software And Hardware DesignPrototyping & Implementation· David MaliniakDFM Remains The Elephant In The RoomDesign & Verification· David MaliniakComplexity Woes Need An Abstraction ReactionEMBEDDED· William WongTo Build More, Buy More Boards And ToolsHardware· William WongThe Wait Is Over For High-Speed Serial InterfacesSoftware· William WongSoftware Attempts To Match The Multicore/Cluster BlitzPOWER· Don TuiteEnergy-Hungry IT Centers See Hope In Digital PowerManagement & Semiconductors· Sam DavisEnergy Star Mandates Power-Efficient PCsPower Sources & Batteries· Sam DavisSingle-Cell Li-Ion Systems Spawn Compatible ICsTEST & MEASUREMENT· Louis E. FrenzelR&D In T&M Leads To New I&T — Innovation & TechnologyWireless Test· Louis E. Frenzel10 Trends Keep Wireless T&M Vendors On Their ToesPXI/LXI· Louis E. FrenzelPXI And LXI Set The Table For A Tasty Test BuffetDESIGN FAQS· Sponsored EditorialSynchronous RectifiersElectronic Design TOC e-Newsletter Contacts
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