SiGe Reveals Intention To Deliver WiMAX Front-End Modules

SiGe Semiconductor has revealed its plans to market a series of RF front-end modules for WiMAX systems that will combine the company's WiMAX power amplifier architecture with its expertise in multi-chip module integration. The modules are expected to be very compact while delivering high efficiency and performance. Scheduled to begin rolling out in early 2008, the first module for sampling, the SE7261, is designed to meet the requirements of laptop computers. SiGe’s roadmap also includes chip-scale modules for handheld products, i.e., PDAs, cellular handsets, and high-output power modules for customer premises equipment.