Thermal Interface Materials Market Set to Grow to $3.7bn by 2025

May 13, 2015
Research by Rachel Gordon, Technology Analyst for IDTechEx says the thermal interface materials (TIM) market - including tapes, adhesives, greases, gels, pastes, elastomeric pads, phase change materials, graphite, solders, compressible materials and liquid metals - will grow from $1.7 billion in 2015 to $3.7 billion in 2025.

Research by Rachel Gordon, Technology Analyst for IDTechEx says the thermal interface materials (TIM) market - including tapes, adhesives, greases, gels, pastes, elastomeric pads, phase change materials, graphite, solders, compressible materials and liquid metals - will grow from $1.7 billion in 2015 to $3.7 billion in 2025. Most growth is due to elastomeric pads, phase change materials and solders. Full details of the analysis is available in the new IDTechEx Research report "Thermal Interface Materials 2015-2025: Status, Opportunities, Market Forecasts" (www.IDTechEx.com/thermal).

Another fast-growing industry is consumer and industrial computing. Until 2004, CPU designers were fitting more transistors into a given area and increasing clock speeds to get better performance, both trends growing exponentially. CPU speed was doubling every 18 months. This continued for decades but has slowed because the heat can't be efficiently dissipated. The industry is worth $65m and is expected to rise to $142m. However, new chip designs, such as ARM chips used in mobile phones and tablets have lower power consumption, so the heat is "designed out" and if these were used in consumer and industrial computing, it could drastically reduce the amount of TIM needed.

After extensive interviews with suppliers, IDTechEx find that the biggest players offer a wide range options and increasingly offer advice and expertise to create a full thermal solution. However, manufacturers of polymeric and metallic TIM, do not consider each other competitors, because they are suitable for different applications and target different markets. Metallic TIMs are only used in applications where the very high intrinsic thermal conductivity is a requirement. The history, technology offerings, business model and addressable markets for 28 key players are described in detail.

This research was conducted for the report, Thermal Interface Materials 2015-2025: Status, Opportunities, Market Forecasts, appraises the ten types of commercially available TIM technology, the key properties when designing thermal solutions, technology benchmarking, eleven key applications, market appraisal, the emerging materials, and forecasts the total market to 2025.

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