Powerelectronics 736 Ir 623 0

Ultra-compact IC package suits alternative energy applications

June 23, 2011
International Rectifier (IR) announces that it has expanded its packaging portfolio with the introduction of a PQFN 4 x 4 mm package featuring the latest high-voltage gate drive ICs that deliver an ultra-compact, high density, and efficient solution for home appliance, industrial automation, power tools, and alternative energy applications.

International Rectifier (IR) announces that it has expanded its packaging portfolio with the introduction of a PQFN 4 x 4 mm package featuring the latest high-voltage gate drive ICs that deliver an ultra-compact, high density, and efficient solution for home appliance, industrial automation, power tools, and alternative energy applications.

The new PQFN4x4 (modified MLPQ 16-lead) package can accommodate many of IR’s high-voltage gate drive ICs that formerly required packages as large as the wide-body SOIC-16, thereby offering an 85% smaller footprint. The new package is designed with the appropriate creepage and clearance requirements to enable reliable designs at voltages up to 600 V.

With a low profile of less than 1 mm, the PQFN4x4 package is compatible with existing surface mount techniques and is MSL2 rated and RoHS compliant. IR’s HVIC technology integrates N-channel and P-channel LDMOS circuitry in an intelligent driver IC. The ICs receive a low-voltage input and provide gate drive and protection features for HV power-conditioning applications.

Additionally, these monolithic HVICs provide integration of features and functionality to simplify circuit design and reduce overall cost, including the option to use a low-cost bootstrap power supply. This eliminates the need for the large, expensive auxiliary power supply that discrete optocoupler or transformer-based designs often require.

For more information, contact International Rectifier, 233 Kansas St., El Segundo, CA 90245. Phone: (310) 252-7105.

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