9-GHz Test Sockets Work With All BGA Package Sizes

Semiconductor devices housed in BGAs and µBGAs having up to 2,500 pins and running at speeds well beyond today's fastest ICs can all be tested, debugged and programmed using a series of ball-grid-array sockets designed to handle bandwidths as high as 9 GHz. Part of the company's Silver Wings family, the new 9-GHz solderless socket systems reportedly can, with just 5 models, handle every BGA lead pitch, ball count and package size currently available.
The socket system has, among other things, a conductive elastomeric contactor pad—users need only change the pad plus an adjuster plate to accommodate different package sizes. The pads also offer a simplified means of adapting the socket to packages having different ball pitches compared to sockets using metal pins. The solderless BGA sockets also have a built-in heatsink, pad life of 5,000 insertions (min.), and less than 50 milliohm contact resistance. Prices range from $2,175 for ET-SW-2000 sockets to $2,425 for ET-SW-6000 units.