ASIC-EDA Alliance Lifts OLA Specification

March 18, 2002
The Open Library Architecture (OLA), an application programming interface specification collaboratively developed at the Silicon Integration Initiative (Si2), has gained a boost through an alliance between Si2's ASIC Council and a group of leading EDA...

The Open Library Architecture (OLA), an application programming interface specification collaboratively developed at the Silicon Integration Initiative (Si2), has gained a boost through an alliance between Si2's ASIC Council and a group of leading EDA companies.

ASIC Council members and EDA vendors will develop OLA-based design kits. The members also plan to endorse static timing sign-off for these products as the design kits come online, as well as accelerate the release of OLA libraries. They'll work with tool vendors on library development and qualification.

OLA is a packaged technology-specific engine that calculates delay with a comprehensive Application Procedural Interface (API). EDA tools can use the API to determine circuit and interconnect characteristics like delay or power. OLA uses the IEEE-1481 (Delay and Power Calculation System) standard as its fundamental architecture. The architecture represents a major paradigm shift over traditional file-based design flows.

ASIC Council members include IBM, Agere Systems, LSI Logic, Philips Semiconductors, Fujitsu, Toshiba, and STMicroelectronics. EDA vendors committed to mutual support and endorsement of the OLA include Cadence Design Systems, Monterey Design Systems, Magma Design Automation, Sequence Design, and Avant! For more information on OLA, visit www.si2.org/ola.

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

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