Heat Sinks Have High Fin Count

April 1, 1999

Designed for power devices, Pentium II CPUs and other BGA devices, the Stacked-Fin heat sink's 13 fins per inch are produced using a proprietary process. Advantages are higher cooling power (about 30% higher than extruded heat sinks, it's claimed), lower unit cost and low custom tooling cost, and shorter lead times for custom designs. Standard size is 2" x 4" x 0.75".

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!