Signal-Integrity Verification Tool Sorts Out Interdependencies

May 27, 2002
Deep-submicron geometries, higher frequencies, and lower supply voltages are making signal-integrity analysis an intractable problem for ASIC designers. Particularly vexing are the interdependencies of signal-integrity issues, leading designers to...

Deep-submicron geometries, higher frequencies, and lower supply voltages are making signal-integrity analysis an intractable problem for ASIC designers. Particularly vexing are the interdependencies of signal-integrity issues, leading designers to chase one down and make fixes that only exacerbate others.

Stepping into the breach is Magma's Diamond SI tool for signoff-quality, post-layout signal-integrity analysis. It examines GDSII layout files for parameters like crosstalk noise, crosstalk delay, voltage drop, and electromigration on both power and signal nets. Most notably, it accounts for the interdependencies among these parameters.

The tool's two-step approach combines the speed of gate-level timing analysis with the accuracy of transistor-level analysis. It pinpoints potential problem nets and then applies Spice-level analysis on them to determine which have actual problems that must be corrected. The tool automatically generates Spice decks for those critical nets and the required switching vectors to enable the dynamic analysis.

Based on Magma's unified data model architecture, Diamond SI uses proven timing, extraction, and analysis engines that have complete access to all design data. As a result, the tool performs concurrent analysis for interdependent signal-integrity effects without relying on file-based interfaces. When used with Magma's IC implementation flow, Diamond SI provides a means of digging out signal-integrity problems throughout the flow.

Diamond SI is available for the Solaris and Linux platforms. Pricing starts at $240,700.

Magma Design Automation Inc., www.magma-da.com; Sameer Patel, (408) 864-2235.

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!