Methodology Kit Demystifies Wireless Design

Jan. 19, 2006
Many challenges are inherent in designing RF transceiver chips. Some of these challenges can cause long, sleepless nights for designers insufficiently versed in analog black magic. These include, but aren't limited to, system-level considerations

Many challenges are inherent in designing RF transceiver chips. Some of these challenges can cause long, sleepless nights for designers insufficiently versed in analog black magic. These include, but aren't limited to, system-level considerations, verification issues, dealing with parasitic extraction, and synthesis of inductors as well as modeling of passives.

Cadence's RF Design Methodology Kit represents an effort to help designers of wireless ICs shorten their cycle by better ensuring that silicon performance is aligned with design intent. The kit leverages various technologies that achieve intelligent management of parasitic extraction. It puts IC design within a system-level context through application of concurrent top-down and bottom-up design processes.

The kit includes an 802.11b/g wireless local-area network transceiver reference design, a full suite of RF verification IP, test plans, and applicability training on the RF design and analysis methodologies. It focuses on front-to-back RF IC design and addresses behavioral modeling, circuit simulation, layout, extraction and resimulation, and inductor synthesis. It also addresses IC verification within a system context.

Links to system-level environments are now offered through Cadence's Virtuoso AMS Designer, a custom mixed-signal design platform that provides links to the Mathworks' Matlab and Simulink. The result is an executable specification that designers can use throughout the design process as a "golden reference" of functionality.

Contact Cadence Design Systems directly to obtain information about availability and pricing.

Cadence Design Systems
www.cadence.com/products/kits/

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

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