Full-Chip Optimization Tool Boosts ICs' Yield And Performance

March 2, 2006
Two pressing issues loom for chip designers—the length of time it takes to achieve design closure and the difficulties in attaining acceptable fab yields. With what Cadence terms "manufacturing-aware" chip optimization, Chip Optimizer addresses bot

Two pressing issues loom for chip designers—the length of time it takes to achieve design closure and the difficulties in attaining acceptable fab yields. With what Cadence terms "manufacturing-aware" chip optimization, Chip Optimizer addresses both issues with a tool that eliminates oversimplified interconnect and process models.

Chip Optimizer models, analyzes, and optimizes the true shapes represented in the physical design as well as the spaces between them. By doing so, it can optimize for manufacturability, yield, and performance simultaneously. For example, the tool can manage wire widths and spacing to optimize coupling capacitance as well as yield issues. It also manages the use of vias so they're located intelligently and judiciously.

In performing its optimizations, Chip Optimizer represents an evolution of earlier state-space exploration tools, taking a 3D view of the design. Shapes and spaces can be positioned in the exact configuration and location required to correct sub-wavelength, spacing, and topological effects.

The tool operates in both the digital and semi-custom design spheres. Falling between place-and-route and signoff, Chip Optimizer's approach to digital designs optimizes them for manufacturing (see the figure). The goal is to avoid post-GDSII processing wherever possible so designers don't lose control of the result. In the semi-custom realm, Chip Optimizer is used primarily in the design of on-chip interconnects.

The tool is a native application developed on the industry-standard OpenAccess design database and interface. It supports Cadence's design platforms as well as third-party flows.

Chip Optimizer is available now. Pricing depends on configuration.

Cadence Design Systems
www.cadence.com

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!