Ball grid array (BGA) and flip-chip applications will benefit from using this BGA paste flux, developed specifically for the attach of high density packages. The proprietary formulation is suitable for pitches as fine as 10 mils, it's claimed, and offers up to 48 hours of tack.The new paste flux is said to provide superior wetting for common substrate finishes, including Ni-Au, HASL, and OSP. High tack prevents component shifting prior to reflow, while increased slump resistance eliminates residue bleed out. The paste flux is available for eutectic and high-temperature soldering application in no-clean, RMA and water-soluble versions. Packaged in 50-, 150- and 300-gram jars, it comes in either red or yellow.