Cooling Assemblies Target Sub-$1000 PCs

Nov. 1, 1999

With PC prices plummeting, pressure has rapidly built on component suppliers to develop more efficient and less costly products. In response to this, cooling assemblies have been developed that combine a heatsink that provides omni-directional airflow with a fan that is said to meet or exceed industry requirements for performance, cost, reliability and noise. The assemblies provide maximum cooling performance and are are aimed at uses in sub-$1000 PCs. The new, easy-to-attach heatsink-and-fan assemblies are available for CPUs made by Intel, AMD, Cyrix, IDT, and other companies- in instances where there is sufficient natural airflow, however, the processors reportedly may require only the heatsink to stay cool.

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