Heatsinks Aid Power Semis

July 1, 2002

Expanding the company’s line of power semiconductor cooling products, the Therma-Fin folded heatsinks are capable of dissipating heat loads up to 2 kW. In addition to high-heat dissipation capability, the sink’s folded-fin design and the incorporation of heat-pipe technology make for a smaller and lighter components. Aluminum or copper fins can be epoxied to the cooling plate or soldered and brazed to increase reliability and minimize thermal resistance. Base options include vapor chambers, copper bases, aluminum bases, and copper or aluminum bases with embedded heat pipes. For prices, call THERMACORE INTERNATIONAL INC., Lancaster, PA. (717) 569-6551.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!