STMicroelectronics and Automotive Communications Systems (ACS) will jointly develop communications chips for the Vehicle and Infrastructure Integration (VII) initiative. VII is investigating the benefits of car-to-car and car-to-roadside high-speed communications with the intention of installing such equipment in all new vehicles sold in North America. STMicroelectronics brings long-term involvement in automotive electronics and chipmaking to the partnership. ACS brings a patent-pending architecture for resolving some of the major challenges facing the VII initiative, including channel access, reliability of communications, and precision vehicle location. "STMicroelectronics' capability in automotive, wireless communication, and location, coupled with ACS' technology will provide significant advantages to the government, auto companies, and their suppliers," Ugo Carena, Corporate VP and General Manager of the Automotive Products Group for STMicroelectronics, said in a statement.