www.infineon.com/hirelrf High reliability microwave & RF components for space Selection guide High reliability RF components for space As a key supplier of discrete semiconductor devices for the high-reliability community, Infineon Technologies has built an excellent reputation in space community for over 40 years. From silicon to backend and screening, Infineon’s RF capabilities include space-qualified silicon microwave transistors and foundry services. Product type Package VBR (min) [V] IF (max) [mA] RF (typ) [mΩ] τ(typ) [ns] CT (typ) [pF] ESA QPL number BAS40-05 (ql) T1 40 120 10.0 – 3.10 5512 020 05 BAS70-04 (ql) T1 70 70 20.0 – 1.50 5512 020 04 BXY42-03 (ql) T1 50 5000 1.2 50 0.26 5513 017 03 BXY43-09 (ql) T1 150 400 1.2 950 0.30 5513 030 09 BXY44-10 (ql) T1 200 400 2.2 1100 0.20 5513 030 10 chip D0337E (ql) die (BAS40-05) – – – – – N.A. chip D0336E (ql) die (BAS70-04) – – – – – N.A. chip D0310G (ql) die (BXY42-03) – – – – – N.A. chip D0309G (ql) die (BXY43-09) – – – – – N.A. chip D0360C (ql) die (BXY44-10) – – – – – N.A. Product type Package VCEO (min) [V] Ic (max) [mA] Ptot (max) [mW] fT [GHz] NF (typ) [dB] ESA QPL number BFY181 (ql) Micro-X1 12.0 20 175 8.0 2.5 @ 2.0 GHz 5611 006 03 BFY182 (ql) Micro-X1 12.0 35 250 8.0 2.5 @ 2.0 GHz 5611 006 04 BFY183 (ql) Micro-X1 12.0 65 450 8.0 2.5 @ 2.0 GHz 5611 006 05 BFY193F (ql) Micro-X1 12.0 80 580 8.0 1.75 @ 2.0 GHz 5611 006 09 BFY196 (ql) Micro-X1 12.0 100 700 6.5 3.2 @ 2.0 GHz 5611 006 07 BFY405 (ql) Micro-X1 4.5 12 55 22.0 1.2 @ 1.8 Ghz 5611 008 01 BFY420 (ql) Micro-X1 4.5 35 160 22.0 1.2 @ 1.8 Ghz 5611 008 02 BFY450 (ql) Micro-X1 4.5 100 450 22.0 1.4 @ 1.8 Ghz 5611 008 03 BFY650B-12 (ql) Micro-X1 4.0 150 600 40.0 0.7 @ 1.8 Ghz 5611 010 05 BFY740B-02 (ql) Micro-X1 4.0 30 120 45.0 1.05 @ 6.0 Ghz 5611 011 02 chip T0349B (ql) die (BFY181) – – – – – N.A. chip T0341 (ql) die (BFY182) – – – – – N.A. chip T0351 (ql) die (BFY183) – – – – – N.A. chip T0359E (ql) die (BFY193F) – – – – – N.A. chip T0395 (ql) die (BFY196) – – – – – N.A. chip T0501 (ql) die (BFY405) – – – – – N.A. chip T0502 (ql) die (BFY420) – – – – – N.A. chip T0503 (ql) die (BFY450) – – – – – N.A. chip T1581C (ql) die (BFY650B-12) – – – – – N.A. chip T1592D (ql) die (BFY740B-02) – – – – – N.A. HiRel silicon bipolar transistors ql (quality level): P – for professional level used in Engineering Modules (EM) ES – for ESA space level for ESA satellites Fligh Modules (FM) ‒ Transition frequency from 8 GHz up to 42 GHz ‒ Output power from 20 mA to 100 mA ‒ Ideal for high frequency appli- cations like LNA or oscillator circuits ‒ TID and SEE radiation hardened Key features Unlike the high-volume markets where low-cost plastic packages are used, the semi- conductor dies for Infineon’s space components are assembled in hermetically sealed packages to create HiRel standard products for professional applications. It should be stressed, however, that these HiRel components take full advantage of the stabilized mass production of wafers for the consumer and commercial markets. All HiRel devices, are also available as qualified chip (bare die) from specially released wafers. Infineon HiRel components are supplied in different quality levels: ‒ “P” for prototype level used in Engineering Modules (EM) ‒ “ES” for ESA space level for Flight Modules (FM) HiRel silicon diodes RF silicon foundry services Infineon is a market leader in radar technology, especially leading in automotive appli- cations and offers its high volume production radar technology with stable process for foundry business. With a low power consumption, a superior low noise performance, a high integration layout due to 130 nm SiGe BiCMOS technology and a high RF amplifica- tion output, the Infineon B11HFC technology sets a benchmark. Infineon’s RF foundry service enables the customer to use this superior, mature radar technology for customized designs, developing markets or low-volume applications. Services include wafer and mask set production of the customer designed IC. Infineon can also recommend experienced partners for design and test of B11HFC silicon. Typical applications include phased array antennas, (RF-) test equipment, satellite ground equipment or any other RF based application. For further information, please contact the RF foundry team: [email protected] ‒ Frequency up to fT = 250 GHz and fmax = 390 GHz ‒ 130 nm SiGe BiCMOS Key features ‒ Engineering mask set production ‒ Engineering wafer run RF foundry services includes 1) Cooperation with design and test house partner possible Other services Infineon also offers the possibility to order Infineon standard components (COTS) with full traceability of wafer lot and production lot. This service is available for packaged components as well as bare die. For further information, please contact the RF foundry team: [email protected] ‒ COTS parts with traceability ‒ COTS chips in small quantity Services include Customer idea Design & Layout1) Device testing1) Integration Mask set production Mask data PDKCustomer CustomerInfineon RF foundry production Wafer Service hotline Infineon offers its toll-free 0800/4001 service hotline as one central number, available 24/7 in English, Mandarin and German. › Germany .................... 0800 951 951 951 (German/English) › China, mainland ....... 4001 200 951 (Mandarin/English) › India .......................... 000 800 4402 951 (English) › USA ............................ 1-866 951 9519 (English/German) › Other countries ......... 00* 800 951 951 951 (English/German) › Direct access ............. +49 89 234-0 (interconnection fee, German/English) * Please note: Some countries may require you to dial a code other than “00” to access this international number. Please visit www.infineon.com/service for your country! Where to buy Infineon distribution partners and sales offices: www.infineon.com/WhereToBuy Please note! This Document is for information purposes only and any information given herein shall in no event be regarded as a warranty, guarantee or descrip- tion of any functionality, conditions and/or quality of our products or any suitability for a particular purpose. With regard to the technical specifica- tions of our products, we kindly ask you to refer to the relevant product data sheets provided by us. Our customers and their technical departments are required to evaluate the suitability of our products for the intended application. We reserve the right to change this document and/ or the information given herein at any time. Additional information For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices, please contact your nearest Infineon Technologies office (www.infineon.com). Published by Infineon Technologies AG Am Campeon 1-15, 85579 Neubiberg Germany © 2023 Infineon Technologies AG. All rights reserved. Public Document number: B155-I1204-V2-7600-EU-EC-P Date: 10 / 2023 Warnings Due to technical requirements, our products may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies Components may only be used in life-support devices or systems with the ex- pressed written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety of effective- ness of that device or system. 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