Ultimate reliability ‒ DLAM QML-V/P ‒ QCI, datapacks ‒ RHA, WLAT Product features ‒ 512 Mbit densities ‒ 133 MHz QSPI data interface ‒ Single channel SPI mode for legacy support ‒ TID 300 krad[Si] ‒ SEL: >80 MeV.cm2/mg [LET] @ 125ºC ‒ SEFI: <2.77e-5 err/dev.day ‒ SEU: IMMUNE ‒ Mil temperature grade ‒ 68-lead ceramic flat pack ‒ 100-pin plastic TQFP ‒ DLAM QML-V/P certified Key applications ‒ Space grade FPGA configuration image storage ‒ Standalone boot code storage for space processors Differentiated memory portfolio ‒ Performance ‒ Density ‒ Reliability ‒ Longevity Key features HiRel rad hard non-volatile NOR Flash Infineon Technologies’ HiRel memories perform in the most extreme environments Infineon Technologies offers the industry’s highest performance, low pin- count, radiation hardened by design 512 Mbit rad hard Serial NOR flash. The industry standard Quad Serial Peripheral Interface (QSPI) is simple to use with broad ecosystem support. The rad hard NOR Flash family offers 512 Mbit densities in a ceramic or plastic package coupled with the flexibility and fast performance required by high reliability applications. Our radiation hardened NOR Flash memories provide an ideal FPGA boot/configuration solution for systems with limited space, low signal pin count requirements, low power and offer flexibility, reliability, and performance well beyond ordinary serial flash devices. Our HiRel rad hard NOR Flash memories are ideal for platforms requiring fast boot solutions and offer the highest radiation performance for space-grade FPGAs. Depending on image size, the 512 Mbit rad hard NOR Flash can typical- ly store 2 boot code images and can load a 200 Mbit bitstream in 0.42 seconds. The 512 Mbit rad hard NOR Flash supports a single QSPI interface in a x4 mode and a single channel SPI mode for legacy support. Both interfaces are sup- ported by modern FPGA devices and utilize standard instruction sets. FPGA data storage www.infineon.com PRODUCT BRIEF PRODUCT BRIEF www.infineon.com/hirel Published by Infineon Technologies AG Am Campeon 1-15, 85579 Neubiberg Germany © 2024 Infineon Technologies AG All rights reserved. Document number: B119-I1223-V1-7600-NA-EC-P Date: 12/ 2024 Please note! This Document is for information purposes only and any information given herein shall in no event be regarded as a warranty, guarantee or description of any functionality, conditions and/or quality of our products or any suitability for a particular purpose. With regard to the technical specifications of our products, we kindly ask you to refer to the relevant product data sheets provided by us. Our customers and their technical departments are required to evaluate the suitability of our products for the intended application. We reserve the right to change this document and/or the information given herein at any time. Additional information For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices, please contact your nearest Infineon Technologies office (www.infineon.com). Warnings Due to technical requirements, our products may contain dangerous substances. For information on the types in ques- tion, please contact your nearest Infineon Technologies office. Infineon Technologies Components may only be used in life-support devices or systems with the expressed written ap- proval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-sup- port device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sus- tain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. HiRel rad hard non-volatile NOR Flash Infineon Technologies’ HiRel memories perform in the most extreme environments Radiation hardened memories Infineon’s HiRel rad hard memory products portfolio consists of the world’s most-reliable nonvolatile memory and offers a wide selection of NOR Flash, F-RAM, and SRAM solutions that enhance overall system computing limits, while providing Size, Weight and Power (SWaP) benefits with greater design flexibility to satisfy the needs of today’s advanced space systems and beyond. Support: www.infineon.com/hirelmemory Key features ‒ 512 Mbit density ‒ QSPI interface operating up to 133 MHz ‒ 10k program/erase cycles @ 85°C ‒ 10 years data retention at 125°C ‒ 3.3 V supply voltage ‒ 1.8/3.3 V I/O support ‒ -55 to +125°C military temperature grade ‒ 68-pin ceramic quad flat pack or 100-pin plastic TQFP ‒ DLAM QML-V or QML-P qualified Radiation performance ‒ TID: 300 Krad(Si) ‒ SEL: > 80 MeV.cm2/mg [LET] @ 125°C ‒ SEU: Immune ‒ SEFI: < 2.77e-5 err/dev.day Parts list 1) Total Ionizing Dose [Krad (Si)] 2) Single Event Latchup MeV.cm2/mg [LET] @ 125°C 3) Single Event Upset [err/bit.day] 4) Single Event Functional Interrupt err/dev.day Note: * Coming soon - contact factory for details Density Infineon P/N Description Operating temp Qual. level Package TID1) SEL2) SEU3) SEFI4) 512 Mbit CYRS17B512-133AZMB Quad SPI rad hard NOR Flash, plastic package -55°C to 125°C Infineon qual 100-pin TQFP 300 > 80 Immune < 2.77e-5 CYPT17B512-133AZMB Quad SPI rad hard NOR Flash, plastic package - PROTO -55°C to 125°C PROTOTYPE 100-pin TQFP – – – – *5962F2122201PXE Quad SPI rad hard NOR Flash, plastic package - DLAM -55°C to 125°C QML-P 100-pin TQFP 300 > 80 Immune < 2.77e-5 CYRS17B512-133UZMB Quad SPI rad hard NOR Flash, plastic package -55°C to 125°C Infineon qual 68-pin CQFP 300 > 80 Immune < 2.77e-5 CYPT17B512-133UZMB Quad SPI rad hard NOR Flash, plastic package - PROTO -55°C to 125°C PROTOTYPE 68-pin CQFP – – – – *5962F2122202VYC Quad SPI rad hard NOR Flash, plastic package - DLAM -55°C to 125°C QML-V 68-pin CQFP 300 > 80 Immune < 2.77e-5