Fremont, CA

Dec. 1, 1998

Fremont, CA- The Exposed Pad Package (EPP) from ASAT Inc. increases the firm's offerings of thermally enhanced plastic packages suited for applications requiring small thin packages. Key features of the new package is heat elimination via conduction. When EPP is mounted on a ground plane, it also allows for RF shielding enhancement. The product comes in a variety of JEDEC standard package outlines, including Quad and small outline. Heat is removed from the package via the exposed copper die paddle, which is attached directly to the IC. The low-profile package is said to be cost-effective over other thermal packages.

Sponsored Recommendations

Highly Integrated 20A Digital Power Module for High Current Applications

March 20, 2024
Renesas latest power module delivers the highest efficiency (up to 94% peak) and fast time-to-market solution in an extremely small footprint. The RRM12120 is ideal for space...

Empowering Innovation: Your Power Partner for Tomorrow's Challenges

March 20, 2024
Discover how innovation, quality, and reliability are embedded into every aspect of Renesas' power products.

Article: Meeting the challenges of power conversion in e-bikes

March 18, 2024
Managing electrical noise in a compact and lightweight vehicle is a perpetual obstacle

Power modules provide high-efficiency conversion between 400V and 800V systems for electric vehicles

March 18, 2024
Porsche, Hyundai and GMC all are converting 400 – 800V today in very different ways. Learn more about how power modules stack up to these discrete designs.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!