Fremont, CA- The Exposed Pad Package (EPP) from ASAT Inc. increases the firm's offerings of thermally enhanced plastic packages suited for applications requiring small thin packages. Key features of the new package is heat elimination via conduction. When EPP is mounted on a ground plane, it also allows for RF shielding enhancement. The product comes in a variety of JEDEC standard package outlines, including Quad and small outline. Heat is removed from the package via the exposed copper die paddle, which is attached directly to the IC. The low-profile package is said to be cost-effective over other thermal packages.