EE Product News

Gap Filler Pads Boast Of High Thermal Conductivity

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Introduced as the company's highest performing gap filler pad, the Sarcon GR-I is specifically designed to help keep today's high-power, high-speed electronic designs from overheating. The pads are said to keep the soft, conformable properties of the company's existing gap filler pads, but with thermal conductivity of 5.8W/m-°K, the pads are said to be a cooling solution for designs with severe heat dissipation requirements.

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