EE Product News

Heat Sinks Have High Fin Count

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Designed for power devices, Pentium II CPUs and other BGA devices, the Stacked-Fin heat sink's 13 fins per inch are produced using a proprietary process. Advantages are higher cooling power (about 30% higher than extruded heat sinks, it's claimed), lower unit cost and low custom tooling cost, and shorter lead times for custom designs. Standard size is 2" x 4" x 0.75".

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