EE Product News

Heat Sinks Help Keep High-Speed Chips Cool

Designed for high-speed chips and small packages, ATS folded-fin (corrugated) heat sinks can be customized for many applications in free or forced air convection environments. Folded fin technology offers densities up to 30 fins per inch and sizes up to any specification. Fin heights are up to 2", typically, and custom heights are available.

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