EE Product News

Heatsinks Boast Of Advanced Thermal Design To Tackle Demanding Apps

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By combining a convoluted fin pack with an extruded base, the Hexfin family of heatsinks reportedly is able to meet the demanding thermal management needs of new computer, telecomm and power supply designs. The heatsinks' enhanced performance and cost-effectiveness are said to derive from their ability to accommodate lower thermal resistance requirements. The devices also are engineered to provide considerable design flexibility.

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