EE Product News

No-Clean Solder Paste Leaves Ultra-Low Residue

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Well-suited for screening, fine-pitch stencil printing and syringe dispensing, BOW #1170 No-Clean solder paste is designed for applications where clear, water soluble residues are specified. Manufactured to Bellcore and J-STD-005 specifications, this ultra-low residue paste leaves a non-corrosive, non-conductive, highly insulated, transparent residue. The compound offers a high surface insulation resistance value and excellent dot-to-dot consistency. Additional properties include a long tack time, high tack force and slump resistance.

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