EE Product News

Signal Integrity Analysis Software Adds Visualization

Significant improvements in simulation speed, capacity and ease of use are seen in Maxwell Spicelink 4.0, a suite of tools composed of Maxwell 2D Extractor, Maxwell Q3D Extractor, a GUI-based schematic capture tool, and Maxwell SPICE. New productivity enhancements, data export and visualization capabilities are included in the new version of the signal integrity analysis software. Interconnects can be analyzed with the tools and SPICE models can be created and simulated for uniform transmission lines with Maxwell 2D Extractor. Any discontinuities, such as wire bonds, package leads, connectors, vias and crossovers, can be modeled and simulated with Maxwell Q3D Extractor.


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