EE Product News

Ultra-High-Density Interconnects Squeeze 5000+ I/Os On 1-mm Grid

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A series of interconnect products based on the company's Metallized Particle Interconnect (MPI) technology provides socketing for BGA/LGA packages for chips with I/O counts from 400 to 5000. Contacts can carry 4A each with less than 20 milliohm average resistance. They're said to be virtually transparent to 2-GHz signals with 100-ps rise times. Typical contact inductance is 0.3 nH with mutual capacitance of less than 0.0035 pF.

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