High-tech start-ups to connect with investors at SEMICON Europa

March 17, 2015

Building on last year’s successful inaugural program Innovation Village, SEMICON Europa 2015 (October 6-8 in Dresden) will feature the second edition, connecting early-stage companies with strategic investors, venture capitalists, and other relevant stakeholders. The SEMICON Europa technology and business program agenda addresses the critical issues and challenges facing the microelectronics industries and provides information, education, and guidance for industry professionals to move innovations and products to market. This year’s Innovation Village will bring together innovative European start-up and growth companies with leading investors from semiconductor and related industries.

New in 2015 is cooperation with the incubator “HighTech Startbahn” from Dresden with “HighTech Venture Days.” As a result, the Innovation Village program has expanded to a four-day event with 60 selected companies, six high-tech sectors, speed presentations (pitches), and 60+ investors.

The goal of Innovation Village is to encourage exchanges between high-tech ventures and industry-relevant investors. Participating start-up and growth companies have the opportunity to exhibit for three days at individual kiosks in the Innovation Village exhibition hall, presenting their innovations in a series of short pitches. The Innovation Village features 40 private pitches to investors only, plus 20 public pitches—focusing on information communication technology (ICT), micro- and nanotechnology and related applications, materials science, environment and energy technology, machinery and plant engineering, Industry 4.0 and life science and automotive.

With a dedicated conference program on innovation and a live demonstration day for innovation products and applications, Innovation Village provides a valuable platform for both high-tech ventures as well as investors. The Innovation Village exhibition hall will also host several key industry companies and investors in exclusive booths with private meeting space.

“Saxony has gained a reputation for being one of Europe’s leading regions in innovative research,” said Heinz Kundert, president of SEMI Europe. “With the Innovation Village coming to Dresden for the first time, it is an excellent occasion to demonstrate the region’s capabilities for innovative technologies and products.”

“Dresden has proven to be one of Europe’s leading cities for IC manufacturing and microelectronics-driven technology. The region is also host to a high number of innovations based start-ups,” said Bettina Vossberg, chairwoman of the board of directors, HighTech Startbahn. “With the enhancement of both our strong concepts, it is an excellent occasion to demonstrate Europe’s capabilities in innovation and commercialization of new technologies.”

Innovation Village will represent the most viable new technology in Europe. Interested start-ups and growth companies are invited to fill out a request for participation (RFP) form online at the SEMICON Europa website (www.semiconeuropa.org). RFPs will be judged by the SEMICON Europa Innovation Village Committee and HighTech Startbahn experts in venture capitalism and new technology investment: Tobias Jahn (3M New Ventures), Tony Chao (Applied Ventures LLC), Claus Schmidt (Robert Bosch Venture GmbH), Jim Traynor (TEL Venture), Christophe Desrumeaux (CEA Investissement), Jong Sang Choi (Samsung Ventures), Jean-Marc Girard (Air Liquid Electronics), Jean-Marc Bally (ASTER Capital), Erkki Aaltonen (VTT Ventures), and Pascal Vanluchene (Capital-E).

To encourage visibility for both investors and early stage innovative ventures, Innovation Village conferences and the exhibition will be free for all SEMICON Europa visitors. Speakers will attract diverse visitors, including large companies, SMEs, and start-ups to the Innovation Village area. Dedicated innovation lounge areas set amidst the exhibition kiosks will allow visitors, investors and start-ups to interact with each other.

www.semi.org

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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