Packaging, test issues up for debate at SEMICON West

May 28, 2015

SEMI today announced the SEMICON West 2015 test and packaging program agendas. In addition to over 650 exhibitors, SEMICON West will feature more than 180 total hours of programs—including free technical, applications, and business events as well as exclusive programs.

Exclusive programs include the three-day Semiconductor Technology Symposium (STS), a comprehensive technology and business conference, addressing the key issues driving the future of semiconductor manufacturing and markets. This year, STS includes these programs on packaging and test:

  • “The Very Big Picture, the Future of Semiconductor Packaging Technology” (July 14)—with speakers from companies including 3MTS, AMD, and Oracle plus a panel discussion on “Value vs. Cost”;
  • “Packaging: Digital Health and Semiconductor Technology” (July 14)—with speakers from companies including Cisco, Medicustek, GE Global Research Center, and Medtronic; and
  • “Test Vision 2020: The Road to the Future of Test” (July 15-16)—with keynote from Kaivan Karimi, VP at Atmel Inc., plus speakers Brad Shaffer of IHS and Thomas Burger of AMS.

Test Vision 2020 in turn will include sessions on “Wireless Test in the IoT Era”; “Unique Test Flows for New Cost Challenges”; and “Advanced Packaging, Advanced Test Challenges.” Panel sessions will discuss “How Secure is your Test Data, Really?” and “What Does RF Test Look like in Five Years? Future Solutions for Lowering the Cost of Transceiver Tests.”

In addition, two packaging and test sessions will be offered as part of the TechXPOT program on the exhibition floor (free to exposition attendees):

  • “Automating Semiconductor Test Productivity” (July 14)—a panel of experts from the semiconductor test community, including representatives from TI, STMicro, and ASE, will discuss challenges and opportunities for automating test operations to maximize productivity.
  • “Auto Utopia: Gearing up Semiconductors Turns Dreams to Reality” (July 15)—including speakers from ASE, Gartner, and PRIME Research.

Other key segments at SEMICON West 2015 will focus on

  • the global business outlook;
  • semiconductor fabrication, equipment, and materials;
  • the Internet of Things;
  • MEMS;
  • flexible hybrid electronics;
  • sustainable manufacturing; and
  • next-generation products.

SEMICON West (www.semiconwest.org) continues to feature a full set of complimentary programs, including keynote addresses, executive panels, and technical and business sessions. The Tuesday Keynote Panel features imec, Qualcomm, and Stanford University tackling the issue of “Scaling the Walls of sub-14-nm Manufacturing.” Doug Davis, senior VP and GM, IoT Group at Intel, will present the Wednesday Keynote.

Discounted pricing is available through June 5. Early-bird pricing for the Semiconductor Technology Symposium (STS), Test Vision 2020, and Sustainable Manufacturing Forum (SMF) also applies through June 5.

www.semiconwest.org/Participate/RegisterNow

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!