San Jose, CA. Over 600 electronics professionals are expected to attend the 15th annual Flexible and Printed Electronics Conference and Exhibition (2016FLEX) at the Monterey Marriott February 29-March 3. The event is organized by FlexTech, a SEMI Strategic Association Partner. 2016FLEX features market and technical presentations, short courses, poster sessions, exhibits, and networking, focused on flexible, printed hybrid devices as well as new materials, processes, and equipment.
The technical conference will highlight over 120 presentations selected from U.S. and international submittals. Application experts will cover health monitors, asset monitors, advanced sensors, displays, advanced lighting, energy harvesting, and communications products, from organizations including AU Optronics, Eastman Kodak, Flex International, GE, IBM Research, Interlink Electronics, PARC, SRI, Stanford, and the U.S. Department of Defense (DoD).
Manufacturing and materials experts will cover popular topics include integration of ICs on flexible, stretchable substrates, barrier coatings for components, OLED developments, biometric collection and analysis, power generation, roll-to-roll coating, testing and reliability measurement devices, and new materials for interconnections. 2016FLEX includes presentations from American Semiconductor, Applied Materials, DuPont, ENrG, Sun-Tec, SmartKem, and more.
The conference begins Monday, February 29 with five three-hour short courses:
- “Introducing Printed Electronics—All the Basics and More”;
- “Technology-Readiness Level (TRL) and Manufacturing Readiness Level (MRL) Assessment” (with emphasis on the DoD’s products and processes);
- “Flexible Hybrid Electronics”;
- “Fusion of Fashion and Function: Textiles as a Platform”; and
- “3D Printing on Plastics—Developments & Trends.”
FlexTech will present the 2016 FLEXI awards to leaders in the flexible hybrid electronics community at an industry dinner on Wednesday, March 2. Awards are given to the “Most Innovative Product,” “Most Significant R&D Activity,” “Leadership in Education,” and “Industry Leadership”—a new category this year for individuals who have contributed their talents and time in growing the sector. Student poster awards will also be presented.
2016FLEX is also the first event in which NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, is participating. NextFlex will give an update during a roadmap session and have official meetings with its technology working groups.
FlexTech, a SEMI Strategic Association Partner, is focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible, printed electronics, by developing solutions for advancing these technologies from R&D to commercialization.