SEMICON China 2016 opens in Shanghai

March 15, 2016

Shanghai. Over 50,000 attendees are expected at SEMICON China 2016, which opens tomorrow at Shanghai New International Expo Centre. SEMICON China (March 15-17) offers the latest in technology and innovation for the electronics industry. FPD China and LED China are also co-located with SEMICON China, leveraging opportunities in these related and adjacent markets. Featuring more than 1,000 exhibitors occupying nearly 3,000 booths, SEMICON China is one of the largest expositions in the world.

In 2016, semiconductor fab equipment spending in China is expected to be $5.8 billion, 16% above 2015 spending. In 2016, total spending on semiconductor materials in China is projected to be $6.3 billion, with China representing the highest growth rate at 4% of all the regions tracked by SEMI. The global industry is watching China’s bold industry investment policy closely, and looking for the implementation with its significant potential impact on the global semiconductor manufacturing supply chain. The policies represent major opportunities both for China and global semiconductor supply chain companies who understand and have the ambition to play in the new ecosystem.

Highlights at SEMICON China include keynotes from China Semiconductor Industry Association, SMIC, China National IC Industry Investment Fund, TSMC, Applied Materials, Amkor Technology, TEL, STATS ChipPAC (a JCET Company), and Lam Research. The Tech Investment Forum will feature speakers from Beijing Economic Technological Development Area, SINO IC Capital, Tsinghua University, Evercore, Beijing E-town, West Summit Capital, Summitview Capital, and TCL Capital.

Organized by SEMI and IEEE-EDS, the China Semiconductor Technology International Conference (CSTIC) immediately precedes SEMICON China on March 13-14. CSTIC covers all aspects of semiconductor technology and manufacturing.

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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