Products of the Week: 5-nm Ethernet PHYs, Rugged Supercapacitors

Aug. 25, 2023

Check out these primers on some of the most notable new electronic products and solutions.

Thermal Camera Module Keeps Eye on Excess Heat

The Lepton 3.1R from Teledyne FLIR is a high-performance radiometric thermal camera module with a 95-degree field of view, 160 × 120 resolution, and a scene dynamic range of up to 400°C.

The model maintains the same compact and low-power form factor as the company’s Lepton family of uncooled thermal camera modules, which support a thermal sensitivity of less than 50 mK. The Lepton 3.1R is a drop-in enhancement for existing Lepton-based products It suits everything from early fire detection of factory machinery, electrical switchgear, and data centers to IoT devices for smart homes.

According to Teledyne FLIR, the Lepton family also integrates digital thermal image processing and radiometry, with the ability to take the temperature of every pixel in the scene. Lepton cameras are made possible by wafer-level detector packaging, wafer-scale micro-optics, custom silicon, and easy-to-integrate packaging.

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Featured products include a new automotive-grade power device that unites a standard rectifier and transient voltage suppressor (TVS) for the first time plus a family of supercapacitors suitable for extending primary and backup battery life in systems exposed to harsh environments. Also, learn more about a new family of neural processing unit (NPU) IP targeted at the next generation of AI silicon.

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About the Author

James Morra | Senior Staff Editor

James Morra is a senior staff editor for Electronic Design, where he covers the semiconductor industry and new technology trends. He also reports on the business behind electrical engineering, including the electronics supply chain. He joined Electronic Design in 2015 and is based in Chicago, Illinois.