Duration: 1 hour
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About the Webinar
Learn about how μModule DC/DC regulators are squeezing more functionality into the same PCB area. With their small size, simplified implementation, scalability, and high-power density, μModule DC/DC regulators provide solutions to power applications in industrial, telecom/datacom, and ATE-instrumentation systems. CoP (Component on Package) technology has increased PCB space-savings with integrated thermal benefits to extend into AI/ML (artificial intelligence and machine learning) applications.
Attendees will Learn:
- How increased integration boosts power density
- Component on Package (CoP) technology benefits for thermal performance
- Design solutions for AI/ML systems with scalability up to 2000A and PMBus
Speakers
Jason Sekanina | Principal Engineer, Technical Marketing | Analog Devices
Jason Sekanina is a Product Definer and Principal Engineer for Analog Device’s µModule Power DC/DC group. Prior to moving into Technical Marketing, he was a Design Engineer of µModule DC/DCs, for 14+ years. Along the way, Jason’s Chinese co-workers gave him the name 长发侠 (Taiwanese) or 長髮俠 (Mandarin) - which he strives to live up to.
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