Sponsored Content

Component on Package μModule DC/DC Regulators - Less Heat, More Power

Discover how μModule DC/DC regulators revolutionize PCB designs by compactly integrating enhanced funcationality and thermal advantages, ideal for powering industrial, telcom/datacom, and ATE-instrumentation systems.

This webinar was originally held on October 3, 2024.

Now available for On Demand viewing!

Duration: 1 hour
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About the Webinar

Learn about how μModule DC/DC regulators are squeezing more functionality into the same PCB area. With their small size, simplified implementation, scalability, and high-power density, μModule DC/DC regulators provide solutions to power applications in industrial, telecom/datacom, and ATE-instrumentation systems. CoP (Component on Package) technology has increased PCB space-savings with integrated thermal benefits to extend into AI/ML (artificial intelligence and machine learning) applications.

Attendees will Learn:

How increased integration boosts power density
Component on Package (CoP) technology benefits for thermal performance
Design solutions for AI/ML systems with scalability up to 2000A and PMBus

Speakers

Jason Sekanina | Principal Engineer, Technical Marketing | Analog Devices

Jason Sekanina is a Product Definer and Principal Engineer for Analog Device’s µModule Power DC/DC group. Prior to moving into Technical Marketing, he was a Design Engineer of µModule DC/DCs, for 14+ years. Along the way, Jason’s Chinese co-workers gave him the name 长发侠 (Taiwanese) or 長髮俠 (Mandarin) - which he strives to live up to.

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